• Author: Baeza Alija Daniel
  • Description:

    The main objective in this project has been the design of a printed circuit board which name is Bk1B111E11 and is part from a bigger system, ARAMIS CubeSat.
    ARAMIS project is a low cost solution for any application of small size satellites. The principal element in Bk1B111E11 are the solar cells, there are connected two in each side of the board (two on the bottom and two on the top), that is, four solar cells in total. Besides Bk1B111E11 is part of a deployable structure, the arrangement consist in three tiles attached to CubeSat. The deployable structure is folded in the launch phase to avoid the vibration that can damage any component, then, once is stabilized, the satellite it will be deployed. The solution to keep attached the tiles is a thermal fuser. Each Bk1B111E11 has eight holes, through each one passes a wire which keep join the three tiles, when the tiles should be deploy the thermal fuser works. Thermal fuser is composed by two resistors, one NTC100 and two MOSFETs, the resistors melt the tin (produced by Joule effect) allowing the deployment of the tiles, the NTC100 and the MOSFETs control the temperature so that no component is damaged.
    For the final design of Bk1B111E11 a series of necessary procedure have had to be follow to assure the correct work of the circuit. A database which have facilitate the design has been created. New components, as thermal fuser, has been created and simulated to verify their behaviour. And finally, all the components have been included in the board, and placed keeping all the restrictions and the rules required.
    In conclusion, the board has been assembled and tested, and a microcontroller program has been written to control the temperature of the thermal fuser, since thermal fuser can damage any component if the temperature is no regulated, and therefore the mission could fail.

  • Year: 2018
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